On the improving of the gate oxide reliability

被引:0
|
作者
Bellutti, P [1 ]
Boscardin, M [1 ]
Zen, M [1 ]
Zorzi, N [1 ]
机构
[1] IRST, Microsensors & Syst Integrat Div, I-38050 Trent, Italy
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暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
An improvement of the gate oxide reliability has been obtained using an innovative isolation scheme (DW-LOCOS) in the CMOS sequence fabrication. In particular, the experimental results for the DW-LOCOS samples show that the charge to breakdown of gate oxide is from 5 to 10 times higher than for the conventional CMOS samples. In addition for the DW-LOCOS samples a remarkable weaker dependence of Q(BD) on the stress current polarity has been measured. A possible explanation of this behaviour can be addressed to the quality improvement of the gate oxide layer facing the silicon surface.
引用
收藏
页码:635 / 644
页数:10
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