Effect of ingredients in slurry contaming alumina on chemical mechanical polishing of hard disc substrates

被引:2
|
作者
Sun, J. Z. [1 ]
Pan, G. S. [1 ,2 ]
Zhou, Y. [1 ,2 ]
Zhu, Y. H. [1 ,2 ]
Luo, J. B. [1 ]
Lu, X. C. [1 ]
Liu, Y. [2 ]
机构
[1] Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
[2] Tsinghua Univ, Res Inst, Shenzhen 518057, Peoples R China
关键词
hard disc substrate; chemical mechanical polishing; slurry; alumina; cold weld; MATERIAL REMOVAL; CMP; PLANARIZATION; BEHAVIOR; SIZE;
D O I
10.1243/13506501JET591
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
In this article, new slurry containing alumina abrasives, oxidants, and surface modifiers is developed for the primary polishing of Ni-P-plated hard disc substrates. Compared with commercial slurry, the developed one improves the surface quality drastically by relieving cold weld (CW) and scratch. A fairly high material removal rate (MRR) is obtained when the pH value of the slurry is 3.0. D50 (mean particle diameter) of the alumina abrasive is decreased by using a ball mill, which is effective in alleviating deep scratches and CW Scanning electronic microscope and X-ray diffractometer are used to study the formation mechanism of CW. The oxidant hydrogen peroxide H2O2 is proved to be helpful in eliminating CW and improving the MRR largely. Lauroyl monoethanolamide sulfate C11H23CONHC2H40SO3H as a surface modifier is added to the slurry to improve the surface quality further.
引用
收藏
页码:1003 / 1011
页数:9
相关论文
共 50 条
  • [1] Effect of Ingredients in Slurry Containing Alumina on Polishing of Hard Disk Substrate
    Sun, Jiazhen
    Pan, Guoshun
    Zhou, Yan
    Zhu, Yonghua
    Luo, Jianbin
    Lu, Xinchun
    Liu, Yan
    ADVANCED TRIBOLOGY, 2009, : 993 - +
  • [2] Formulation of slurry for chemical mechanical polishing of Cu substrates
    Hazarika, Jenasree
    Patil, Chetana Sudhakar
    Rajaraman, Prasanna Venkatesh
    MATERIALS TODAY-PROCEEDINGS, 2021, 39 : 1781 - 1785
  • [3] Effect of Abrasive and Surfactant on Chemical Mechanical Polishing of Hard Disk Substrates
    Wang, Shengli
    Li, Zhenxia
    Yang, Libing
    Liu, Libin
    Tian, Yu
    ADVANCED MANUFACTURING TECHNOLOGY, PTS 1-3, 2011, 314-316 : 133 - +
  • [4] Stabilization of alumina slurry for chemical-mechanical polishing of copper
    Clarkson Univ, Potsdam, United States
    Langmuir, 15 (3563-3566):
  • [5] Stabilization of alumina slurry for chemical-mechanical polishing of copper
    Luo, Q
    Campbell, DR
    Babu, SV
    LANGMUIR, 1996, 12 (15) : 3563 - 3566
  • [6] Stabilization of gamma alumina slurry for chemical-mechanical polishing of copper
    Song, Myung-Geun
    Lee, Jin-ho
    Lee, Yoon-Gyu
    Koo, Ja-ho
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2006, 300 (02) : 603 - 611
  • [7] Preparation of Silica-based Alkaline Slurry and Its Application on Chemical Mechanical Polishing of Hard Disk Substrates
    Wang, Shengli
    Li, Zhenxia
    Mu, Huilai
    Tian, Yu
    Yang, Libing
    FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE, PTS 1-4, 2011, 44-47 : 3067 - +
  • [8] ON POLISHING AND EROSION OF ALUMINUM SUBSTRATES BY A JET OF ALUMINA SLURRY
    Patel, Shreyansh
    Mueftue, Sinan
    PROCEEDINGS OF THE ASME/STLE INTERNATIONAL JOINT TRIBOLOGY CONFERENCE - 2011, 2012, : 369 - 371
  • [9] Effect of slurry surfactant on nanotopography impact in chemical mechanical polishing
    Katoh, T. (tkatoh@sumcosi.com), 1600, Japan Society of Applied Physics (42):
  • [10] Effect of slurry surfactant on nanotopography impact in chemical mechanical polishing
    Katoh, T
    Kim, SJ
    Paik, U
    Park, JG
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2003, 42 (9A): : 5430 - 5432