Overview of conductive adhesive interconnection technologies for LCD's

被引：5
|
作者：
Kristiansen, H
Liu, JH
机构：
来源：
PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS | 1997年
关键词：
D O I：
10.1109/PEP.1997.656494
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：223 / 232
页数：10
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