Enhanced Heat Dissipation in Gallium Nitride-Based Light-Emitting Diodes by Piezo-phototronic Effect

被引:21
|
作者
Guo, Qi [1 ,2 ,3 ,4 ]
Li, Ding [2 ,3 ]
Hua, Qilin [2 ,3 ]
Ji, Keyu [1 ,2 ,3 ,4 ]
Sun, Wenhong [4 ]
Hu, Weiguo [1 ,2 ,3 ]
Wang, Zhong Lin [1 ,2 ,3 ]
机构
[1] Guangxi Univ, Ctr Nanoenergy Res, Sch Phys Sci & Technol, Nanning 530004, Guangxi, Peoples R China
[2] Chinese Acad Sci, CAS Ctr Excellence Nanosci, Beijing Inst Nanoenergy & Nanosyst, Beijing Key Lab Micronano Energy & Sensor, Beijing 101400, Peoples R China
[3] Univ Chinese Acad Sci, Sch Nanosci & Technol, Beijing 100049, Peoples R China
[4] Guangxi Univ, Res Ctr Optoelect Mat & Devices, Sch Phys Sci & Technol, Nanning 530004, Peoples R China
基金
中国国家自然科学基金;
关键词
GaN-based LEDs; self-heating effect; thermal management; infrared thermography; piezo-phototronic effect; MULTIPLE-QUANTUM WELLS; THERMAL MANAGEMENT; GAN; PERFORMANCE; DEVICES; LEDS; PIEZOTRONICS; EFFICIENCY; FIELDS; ARRAY;
D O I
10.1021/acs.nanolett.1c00999
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
As a new generation of light sources, GaN-based light-emitting diodes (LEDs) have wide applications in lighting and display. Heat dissipation in LEDs is a fundamental issue that leads to a decrease in light output, a shortened lifespan, and the risk of catastrophic failure. Here, the temperature spatial distribution of the LEDs is revealed by using high-resolution infrared thermography, and the piezo-phototronic effect is proved to restrain efficaciously the temperature increment for the first time. We observe the temperature field and current density distribution of the LED array under external strain compensation. Specifically, the temperature rise caused by the self-heating effect is reduced by 47.62% under 0.1% external strain, which is attributed to the enhanced competitiveness of radiative recombination against nonradiative recombination due to the piezo-phototronic effect. This work not only deepens the understanding of the piezo-phototronic effect in LEDs but also provides a novel, easy-to-implement, and economical method to effectively enhance thermal management.
引用
收藏
页码:4062 / 4070
页数:9
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