A new structure and its analytical model for the electric field and breakdown voltage of SOI high voltage device with variable-k dielectric buried layer

被引:86
|
作者
Luo, Xiaorong [1 ]
Zhang, Bo [1 ]
Li, Zhaoji [1 ]
机构
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China
基金
中国国家自然科学基金;
关键词
low-k dielectric; electric field; modulation; breakdown voltage; RESURF;
D O I
10.1016/j.sse.2007.01.034
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new SOI high voltage device structure with variable-k (permittivity) dielectric buried layer (VK SOI) is proposed in this paper. In this structure, the buried layer is made of two dielectrics, one of which is the low-k dielectric. The breakdown voltage is enhanced due to the modulation effect of the variable-k buried layer on the electric fields in the buried layer and drift region. An analytical model for the electric field and breakdown voltage in VK SOI is presented taking the modulation effect into account, from which the RESURF condition is derived. The dependences of the electric field distribution and breakdown voltage on the device parameters for VK SOI are investigated. Compared with the conventional SOL the electric field of the buried layer and breakdown voltage of VK SOI with relative permittivity k(12) = 2 of the low-k dielectric are enhanced by 81% and 56%, respectively. The analytical results are in good agreement with those of 2D simulations. Finally, the proposed model and RESURF condition can be well applied to the conventional SOI and also extended to VT SOI (variable thickness buried layer SOI) devices. (C) 2007 Published by Elsevier Ltd.
引用
收藏
页码:493 / 499
页数:7
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