Calculations of return loss of bonding wires fabricated on a test board by FDTD method

Return losses of bonding wires fabricated on a test board for RF and microwave circuit applications are studied by the finite-difference time-domain (FDTD) method. Simulation results of return losses obtained by the FDTD method are presented and compared with those obtained by the HFSS software and measurements at frequencies of 0.04-6 GHz. It is found that simulation results calculated by the FDTD method make a good agreement with those obtained by the HFSS software. Results of the FDTD method are also further validated by the measurement data. (C) 2007 Wiley Periodicals, Inc.