Composition tailored isotropic and anisotropic wet etching of glass

被引:3
|
作者
Manasa, Aibhattra M. [1 ]
Deepu, Bagur R. [1 ]
Savitha, Purakkat [1 ]
机构
[1] Indian Inst Sci, Ctr Nano Sci & Engn, Natl Nanofabricat Ctr, Bangalore 560012, Karnataka, India
关键词
Borofloat-33; glass; Soda lime glass; Anisotropic and Isotropic etch;
D O I
10.1016/j.matpr.2020.12.952
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The major composition of any glass substrates consists of more than 70% silicon dioxide with varying concentration of alkali and alkaline earth metals with minor additives such as Al2O3, B2O3 etc. In this study, glass substrates of different compositions were etched successfully using HF based wet etchants. The etch rate as well as the etched profile is greatly dependent on the composition of the glass substrate being used. Two different composition of glasses, wherein the alkali and alkaline earth metals are in different concentrations were used for the etch profile study. One is Borofloat-33 with no free metal ions and the other is Soda lime glass with free metal ions. The etched profile for Borofloat-33 glass had a partial anisotropy with an inclined angle of 33.7 degree while isotropic etch was obtained with soda lime glass. This anisotropy was maintained for Borofloat-33 glass even after continuous agitation during the etch process. The wet etch selectivity of the glass with respect to stack of a-Si/Cr/Au has been established for similar to 106 mu m deep etching. (C) 2020 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1270 / 1273
页数:4
相关论文
共 50 条
  • [1] Fabrication of amorphous carbon cantilever structures by isotropic and anisotropic wet etching methods
    Sheeja, D
    Tay, BK
    Yu, LJ
    Chua, DHC
    Milne, WI
    Miao, J
    Fu, YQ
    [J]. DIAMOND AND RELATED MATERIALS, 2003, 12 (09) : 1495 - 1499
  • [2] Wet etching of glass
    Iliescu, Ciprian
    Tay, Francis E. H.
    [J]. CAS 2005: INTERNATIONAL SEMICONDUCTOR CONFERENCE, 2005, 1-2 : 35 - 44
  • [3] On the wet etching of Pyrex glass
    Iliescu, Ciprian
    Chen, Bangtao
    Miao, Jianmin
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2008, 143 (01) : 154 - 161
  • [4] Wet etching of Pyrex glass
    Zhou, Jian
    Yan, Gui-Zhen
    [J]. Weixi Jiagong Jishu/Microfabrication Technology, 2004, (04):
  • [5] Titanium isotropic and anisotropic etching for MEMS applications
    Ettouri, Rim
    Tillocher, Thomas
    Lefaucheux, Philippe
    Boutaud, Bertrand
    Phung, Jodie
    Philippe, Hadrien
    Dussart, Remi
    [J]. 2021 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS, 2021,
  • [6] Silicon isotropic and anisotropic etching for MEMS applications
    Negi, S.
    Bhandari, R.
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (02): : 203 - 210
  • [7] Fabrication of the microfluidic channels in silicon wafers using isotropic wet etching method: the impact of the composition of HNA solution on etching
    Dewangan, Priyanka
    Purohit, Soumya
    Sahu, Vishal
    Vardhan, Robbi Vivek
    Peddigari, Mahesh
    Pal, Prem
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2024,
  • [8] Anisotropic/Isotropic Atomic Layer Etching of Metals
    Kim, Doo San
    Kim, Ju Eun
    Gill, You Jung
    Jang, Yun Jong
    Kim, Ye Eun
    Kim, Kyong Nam
    Yeom, Geun Young
    Kim, Dong Woo
    [J]. APPLIED SCIENCE AND CONVERGENCE TECHNOLOGY, 2020, 29 (03): : 41 - 49
  • [9] Silicon isotropic and anisotropic etching for MEMS applications
    S. Negi
    R. Bhandari
    [J]. Microsystem Technologies, 2013, 19 : 203 - 210
  • [10] ANISOTROPIC WET ETCHING OF ALUMINUM ELECTRODES BY AN EVACUATED ETCHING SYSTEM
    HARA, T
    HIRAYAMA, T
    ANDO, H
    FURUKAWA, M
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (12) : 2973 - 2975