Optimal heatsink design for a solid-state relay using a 3D modeling and simulation software

被引：0
|
作者：
Plesca, A. [1 ]
机构：
[1] Gh Asachi Tech Univ, Fac Elect Engn, Dept Power Engn, Iasi 700050, Romania
来源：
2006 International Conference on Power Systems Technology: POWERCON, Vols 1- 6 | 2006年
关键词：
heating; modeling; relays; simulation software; temperature; thyristors;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An important power electronic device within automation power systems is the solid-state relay. In many cases, catastrophic failure is a result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used. Starting on initial heatsink dimensions, It has been modified the base plate thickness, length and fin dimensions in order to get a maximum thermal transfer from the triac chip to the environment. Finally, it was obtained a heatsink with new dimensions that allow a better cooling for the triac mounted on it. The experimental tests have confirmed the simulation results. Therefore, the usage of the specific 3D modeling and simulation software allow to design special heatsinks to make a better cooling of the power electronic components at given operating conditions.
引用
收藏
页码：2374 / 2379
页数：6
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