A surface equivalence-based method to enable rapid design and layout iterations of coupled electromagnetic components in integrated packages

被引：3

作者：

Chakraborty, S ^{[1
]}

Jandhyala, V ^{[1
]}

机构：

[1] Univ Washington, Dept Elect Engn, Seattle, WA 98195 USA

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2004年

关键词：

D O I：

10.1109/EPEP.2004.1407542

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel methodology is presented that expedites the electromagnetic analysis in the design cycle of individual layout components in close proximity to other radiating and electromagnetic structures. The proposed method retains all the advantages of a surface based moment method technique, but avoids explicit modeling of the interactions between the object under design and the neighboring ones, without compromising on the accuracy of capturing the electromagnetic coupling between them. As a result the simulation time in individual design cycle is greatly reduced.

引用

页码：45 / 48

页数：4