Electronic textile (e-textile) systems require reliable interfaces between materials with dissimilar mechanical properties, as they contain a combination of rigid and flexible or stretchable parts. For example, textile sensors, such as those knit or woven from conductive fibers, or printed onto textiles with conductive inks, often need to be connected to rigid electronic components. Rather than directly attaching rigid components to textile substrates, interposers-devices that route between different types of contact, or components with mismatched pitch-can be used. We demonstrate two variations on an interposer for connecting stitched conductive tracks on textiles to flexible PCBs, using two types of connectors not previously used in e-textiles. This format enables modular design, where an e-textile system is constructed from discrete parts which can be easily removed and replaced, for repair, updating, or recycling. In this letter, interposer prototypes were subjected to preliminary mechanical and electrical testing, showing good resistance to repeated bending and twisting.
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Univ Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, AustriaUniv Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, Austria
Root, Waleri
Aguilo-Aguayo, Noemi
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Univ Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, AustriaUniv Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, Austria
Aguilo-Aguayo, Noemi
Landsiedel, Justus
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Univ Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, AustriaUniv Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, Austria
Landsiedel, Justus
Bechtold, Thomas
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Univ Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, AustriaUniv Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, Austria
Bechtold, Thomas
Tung Pham
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Univ Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, AustriaUniv Innsbruck, Res Inst Text Chem Phys, Hoechsterstr 73, A-6850 Dornbirn, Austria
Tung Pham
PROCEEDINGS OF THE 2019 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2019),
2019,
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Amirkabir Univ Technol, Inst Adv Text Mat & Technol ATMT, Text Engn Dept, Adv Fibrous Mat LAB, Tehran, IranAmirkabir Univ Technol, Inst Adv Text Mat & Technol ATMT, Text Engn Dept, Adv Fibrous Mat LAB, Tehran, Iran
Abrishami, S.
Shirali, A.
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Amirkabir Univ Technol, Inst Adv Text Mat & Technol ATMT, Text Engn Dept, Adv Fibrous Mat LAB, Tehran, IranAmirkabir Univ Technol, Inst Adv Text Mat & Technol ATMT, Text Engn Dept, Adv Fibrous Mat LAB, Tehran, Iran