System Integration of Nanostructured Materials for Point-of-Care Immune Biosensing

被引：0
|
作者：
Park, Younggeun [1 ]
Ryu, Byunghoon [1 ]
Liang, Xiaogan [1 ]
Kurabayashi, Katsuo [1 ,2 ]
机构：
[1] Univ Michigan, Dept Mech Engn, 2350 Hayward St, Ann Arbor, MI 48109 USA
[2] Univ Michigan, Dept Elect Engn & Comp Sci, 2350 Hayward St, Ann Arbor, MI 48109 USA
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
基金：
美国国家科学基金会;
关键词：
D O I：
10.23919/ltb-3d.2019.8735235
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We report on system integration of plasmonic nanoparticles and a few-layered molybdenum disulfide (MoS2) photoconductive nanochannel sheet on a silicon substrate. Plasma-assisted electrostatic bonding and van der Waals bonding are employed to create a high-sensitivity photoelectronic biosensor for immunological analysis.
引用
收藏
页码：27 / 27
页数：1
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