Environmental improvements through media packaging

被引：0
|
作者：
Kippes, Kyle [1 ]
Dunaway, Pat [1 ]
Biggs, John [1 ]
Parrot, Ryan [1 ]
Young, David [1 ]
Hill, Charlie [1 ]
机构：
[1] Intel Corp, Chandler, AZ 85226 USA
来源：
2020 31ST ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2020年
关键词：
Carbon Footprint; 300mm; thermoform tray; Recycle; Desiccant;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This poster abstract will focus on environmentally friendly media and packaging solutions engineered by the Transport Materials and Media Engineering (TMME) group within Intel's Logistics Division. The TMME group has made many improvements that have reduced the environmental impact of our shipping media and packaging materials for our factories thereby reducing our material and freight cost while also reducing our total carbon footprint.
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页数：5
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