Consequences of a Room-Temperature Plastic Deformation During Processing on Creep Durability of a Ni-Based SX Superalloy

被引:19
|
作者
Hamadi, Sarah [1 ]
Hamon, Florence [2 ]
Delautre, Joel [1 ]
Cormier, Jonathan [2 ]
Villechaise, Patrick [2 ]
Utada, Satoshi [1 ,2 ]
Kontis, Paraskevas [3 ]
Bozzolo, Nathalie [4 ]
机构
[1] Safran Aircraft Engines, Site Villaroche, F-77550 Moissy Cramayel, France
[2] CNRS, UPR 3346, Phys & Mech Mat Dept, Inst Pprime,ISAE ENSMA, BP 40109, F-86961 Futuroscope, France
[3] Max Planck Inst Eisenforsch GmbH, Max Planck Str 1, D-40237 Dusseldorf, Germany
[4] PSL Res Univ, MINES ParisTech, CNRS, Ctr Mise Forme Mat,UMR 7635,CS 10207, Rue Claude Daunesse, F-06904 Sophia Antipolis, France
关键词
SINGLE-CRYSTAL SUPERALLOY; PRE-STRAIN; RECRYSTALLIZATION; BEHAVIOR; MECHANISMS; DEGRADATION; ALLOY; MICROSTRUCTURE; EVOLUTION; FRACTION;
D O I
10.1007/s11661-018-4748-3
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Ni-based single crystalline superalloys are used for high-pressure parts of aero-engines due to their superior mechanical properties and very good oxidation resistance at high temperature. However, shocks or unexpected mismatch in thermal contraction between molds and castings can occur during casting process and subsequent heat treatments, inducing plastic deformation of the alloy at low temperature. To mimic such events, a tensile plastic deformation is applied at room temperature on solutioned AM1 specimens and followed by standard aging heat treatments. Faster growth of the gamma' precipitates inside plastically deformed bands is obtained after full heat treatment with no lattice rotation or recrystallization. It has however been evidenced that the applied deformation has a detrimental impact on the creep properties, especially at high temperature (above 950 degrees C). It partly results from a highly localized failure process along former slip bands in which recrystallization is observed. The evolution of the microstructure during creep tests of prior deformed and nondeformed specimens has been thoroughly investigated to better identify under which conditions recrystallization occurs inside the bands during a creep test and by which mechanism.
引用
收藏
页码:4246 / 4261
页数:16
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