Characterization of friction during the demolding of microstructures molded by hot embossing

被引：0
|
作者：
Worgull, M. [1 ]
Hetu, J. -F. [1 ]
Kabanemi, K. K. [1 ]
Heckele, M. [1 ]
机构：
[1] Forschungszentrum Karlsruhe, Inst Mikrostrukturtech, Postfach 36 40, D-76021 Karlsruhe, Germany
来源：
DTIP 2006: SYMPOSIUM ON DESIGN,TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2006 | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Today, hot embossing and injection molding belong to the established plastic molding processes in microengineering. Based on experimental findings, a variety of microstructures have been replicated so far using the above processes. However, with increasing requirements regarding the embossing surface and the simultaneous decrease of the structure size down into the nanorange, increasing know-how is needed to adapt hot embossing to industrial standards. To reach this objective, a German-Canadian cooperation project has been launched to study hot embossing theoretically by a process simulation and experimentally. The present publication shall report about an important aspect the determination of friction during the demolding of microstructures. https://hal.archives-ouvertes.fr/hal-00189317/document
引用
收藏
页码：380 / +
页数：3
相关论文
共 50 条
  • [1] Hot embossing of microstructures: characterization of friction during demolding
    M. Worgull
    J. -F. Hétu
    K. K. Kabanemi
    M. Heckele
    Microsystem Technologies, 2008, 14 : 767 - 773
  • [2] Hot embossing of microstructures:: characterization of friction during demolding
    Worgull, M.
    Hetu, J. -F.
    Kabanemi, K. K.
    Heckele, M.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2008, 14 (06): : 767 - 773
  • [3] Analysis of the demolding forces during hot embossing
    Guo, Yuhua
    Liu, Gang
    Zhu, Xuelin
    Tian, Yangchao
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2007, 13 (5-6): : 411 - 415
  • [4] Analysis of the demolding forces during hot embossing
    Yuhua Guo
    Gang Liu
    Xuelin Zhu
    Yangchao Tian
    Microsystem Technologies, 2007, 13 : 411 - 415
  • [5] Effects of Friction Coefficient and Cohesion between a Mold and a Polymer Resist during Demolding Process in Hot Embossing
    Zhang, Rui
    Wang, Qing
    Zheng, Xu
    Ma, Lijun
    Zhang, Jintao
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2016, 29 (01) : 39 - 44
  • [6] Analysis and characterization of demolding of hot embossed polymer microstructures
    Dirckx, Matthew E.
    Hardt, David E.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2011, 21 (08)
  • [7] STUDY ON STRESS AND THERMAL CONTRACTION DURING COOLING AND DEMOLDING IN HOT EMBOSSING
    Gomez, Juan. A.
    Lek, Devanda
    Song, In-Hyouk
    Chun, Du-Hwan
    You, Byoung H.
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10, 2015,
  • [8] Demolding strategy to improve the hot embossing throughput
    Leveder, Tanguy
    Landis, Stefan
    Davoust, Laurent
    Soulan, Sebastien
    Chaix, Nicolas
    EMERGING LITHOGRAPHIC TECHNOLOGIES XI, PTS 1 AND 2, 2007, 6517
  • [9] Simulation of Filling Characteristics during Hot Embossing of Polymer Microstructures
    Jin, Peng
    Gao, Yulong
    Liu, Tingting
    FIFTH INTERNATIONAL SYMPOSIUM ON INSTRUMENTATION SCIENCE AND TECHNOLOGY, 2009, 7133
  • [10] Micro hot embossing for replication of microstructures
    Shan, XC
    Maeda, R
    Murakoshi, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2003, 42 (6B): : 3859 - 3862
12345