Process monitoring methodology using in-line parametric test

被引：0
|
作者：
Nishitsuru, Kazunori [1 ]
Kawamata, Nobuhiro [1 ]
机构：
[1] Formfactor KK, Paramet Test Product Grp, Shinagawa Ku, Tokyo 1400013, Japan
来源：
SOLID STATE TECHNOLOGY | 2007年 / 50卷 / 07期
关键词：
Electric variables measurement - Semiconductor device manufacture;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The relentless demand for consumer electronics products with more functions in smaller sizes is driving semiconductor manufacturers to fabricate smaller devices at shrinking process nodes. These smaller geometries coupled with new materials and process steps can generate new types of electrical device flaws during the total fabrication process. An alternative approach to in-line parametric metrology that leverages wafer probe card technology to take direct electrical measurements on product wafers will be necessary to ensure reasonable cost-of-test.
引用
收藏
页码：42 / 43
页数：2
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