Reliability of electroplated Sn-37Pb solder bumps with different under bump metallizations (UBMs) during high temperature storage test

被引：0
|
作者：
Koo, Ja-Myeong [1 ]
Kim, Dea-Gon [1 ]
Jung, Seung-Boo [1 ]
机构：
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, 300 Cheoncheon Dong, Suwon 440746, South Korea
来源：
ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2 | 2007年 / 124-126卷
关键词：
flip Chip; Sn-37Pb (eutectic tin-lead); solder bump; isothermal aging; high temperature; storage test (HTS test); under bump metallization (UBM); ball shear test; interfacial reaction;
D O I：
10.4028/www.scientific.net/SSP.124-126.5
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The interfacial reactions and shear properties of Sn-37Pb (wt.%) solder bumps with two different under bump metallizations (UBMs), Cu and Ni, were investigated after high temperature storage (HTS) tests at 150 degrees C for up to 65 days. Two different intermetallic compounds (IMCs), Cu6Sn5 and Cu3Sn, were formed at the bump/Cu interface, whereas only a Ni3Sn4 IMC layer was formed at the bump/Ni interface. The thicknesses of these IMCs increased linearly with the square root of duration time. The IMC growth rate at the bump/Cu UBM interface was much greater than that at the bump/Ni UBM interface. The shear properties of the bumps with the Cu UBM were greatly decreased with increasing duration time, compared with those with the Ni UBM.
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页码：5 / +
页数：2
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