Mechanisms of silicon polishing chemical, mechanical and electrical effects

被引：0
|
作者：
Samitsu, Y [1 ]
机构：
[1] Okamoto Machine Tool Works Ltd, Kanagawa, Japan
来源：
ADVANCES IN ABRASIVE TECHNOLOGY | 1997年
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This paper clarifies the thus far elusive mechanism of silicon wafer polishing in terms of the mechanical effect chemical effect, and electrical effect on a single abrasive grain at the atomic scale, and then compares each of these effects with the actual phenomena of silicon wafer polishing.
引用
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页码：57 / 60
页数：4
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