共 43 条
- [1] Effect of PCB finish on the reliability and wettability of ball grid array packages [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (02): : 320 - 330
- [2] Cao CD, 2002, J MATER SCI TECHNOL, V18, P73
- [3] THE INFLUENCE OF MICROGRAVITY ON THE SOLIDIFICATION OF ZN-BI IMMISCIBLE ALLOYS [J]. METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1980, 11 (10): : 1665 - 1676
- [4] EFFECT OF APPLIED MAGNETIC-FIELDS DURING DIRECTIONAL SOLIDIFICATION OF EUTECTIC BI-MN [J]. METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1984, 15 (12): : 2155 - 2161
- [5] VERY LOW FREQUENCY INTEGRATING VIBRATING SAMPLE MAGNETOMETER (VLFVSM) WITH HIGH DIFFERENTIAL SENSITIVITY IN HIGH DC FIELDS [J]. REVIEW OF SCIENTIFIC INSTRUMENTS, 1968, 39 (02): : 171 - &
- [6] GELLES SH, 1977, TM78125 NASA
- [7] HOMOGENEOUS NUCLEATION WITHIN THE LIQUID MISCIBILITY GAP OF ZN-PB ALLOYS [J]. SCRIPTA METALLURGICA ET MATERIALIA, 1993, 28 (11): : 1329 - 1334
- [8] Guo JJ, 2001, SCRIPTA MATER, V45, P1197, DOI 10.1016/S1359-6462(01)01150-2
- [9] HAO WX, 2004, SPEC CAST NONFERROUS, V3, P22
- [10] He J, 2006, ACTA METALL SIN, V42, P67