The influence of the deposition angle on the composition of reactively sputtered thin films

被引:7
|
作者
Nyberg, T
Nender, C
Hogberg, H
Berg, S
机构
[1] Univ Uppsala, Dept Solid State Elect, S-75121 Uppsala, Sweden
[2] Univ Uppsala, Dept Inorgan Chem, S-75121 Uppsala, Sweden
来源
SURFACE & COATINGS TECHNOLOGY | 1997年 / 94-5卷 / 1-3期
基金
瑞典研究理事会;
关键词
deposition angle; reactively sputtered thin films; film composition;
D O I
10.1016/S0257-8972(97)00340-X
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We have performed computer simulations and experimental studies of the compositional behaviour of reactively sputter-deposited films as a function of the deposition angle. The composition of deposited films is essentially determined by the supply rate of both sputtered material and reactive gas atoms to the substrate surface. The sputtered flux distribution has a preferential direction away from the target while the reactive gas flux distribution atoms is primarily isotropic in the deposition chamber. The supply of sputtered material to the substrate surface is therefore angular dependent while the supply of reactive species is not. The film composition is consequently angular dependent. Our findings show that the film has a higher content of the stoichiometric compound for higher deposition angles. (C) 1997 Elsevier Science S.A.
引用
收藏
页码:242 / 246
页数:5
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