A study of virtual lithography process for polymer directed self-assembly

被引:3
|
作者
Kim, Sang-Kon [1 ]
Oh, Hye-Keun [1 ]
Jung, Young-Dae [1 ]
An, Ilsin [1 ]
机构
[1] Hanyang Univ, Dept Appl Phys, Ansan 426791, South Korea
基金
新加坡国家研究基金会;
关键词
Lithography; Lithography simulation; Self-assembly; Self-assembly process; BLOCK-COPOLYMERS; ARRAYS;
D O I
10.1016/j.mee.2009.12.029
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For the feature size scaling down to tens of nanometers, the top-down approaches are getting more severe because the extremely ultra-violet (EUV) technique, the high-index fluid-based immersion ArF lithography, and the double patterning technology (DPT) under development may be cover one or two generations. An alternative technology to extend lithography patterning beyond current resolution limits is to combine the top-down lithography and bottom-up assembly. In this paper, an directed self-assembly lithography process of "bottom-up" block copolymer self-assembly, is modeled and simulated in molecular-scale. Impacts of block polymer components on pattern formation are analyzed and discussed. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:883 / 886
页数:4
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