Integration of Self-Assembled Inductors with CMOS LC Oscillators

被引:0
|
作者
Mukherjee, A. G. [1 ]
Vatti, S. [1 ]
Kiziroglou, M. E. [1 ]
Moseley, R. W. [2 ]
Papavassiliou, C. [1 ]
Holmes, A. S. [1 ,2 ]
Yeatman, E. M. [1 ,2 ]
机构
[1] Imperial Coll London, Dept Elect & Elect Engn, London SW7 2AY, England
[2] Microsa Syst Ltd, Woking GU21 5BX, Surrey, England
基金
英国工程与自然科学研究理事会;
关键词
MEMS; RF oscillators; integrated inductors;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The quality factor (Q) of integrated inductors is of great importance to radio frequency applications. Monolithic integration of out-of-plane Au inductors with Complementary Metal-Oxide-Semiconductor (CMOS) LC oscillators is reported in this paper. The recently developed self-assembly process involves in-plane fabrication of Au inductors and subsequent rotation of the structure by surface tension forces of a melting Sn hinge. The CMOS compatibility of this process is demonstrated through the integration of an LC oscillator with the self-ssembled inductor using post-CMOS processing. At a 1.48 GHz oscillation frequency, a phase noise of -95 dBc/Hz is reported at a 100 kHz frequency offset. Obtained results show this technique to be promising for the integration of high Q inductors with commercial RF systems.
引用
收藏
页码:1876 / +
页数:2
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