Stress field near crack close to bonding interface in explosion clad plate

被引:3
|
作者
Oda, I
Tanaka, Y
Masuki, A
Izuma, T
机构
[1] Kumamoto Univ, Dept Mech Engn & Mat Sci, Kumamoto 8608555, Japan
[2] Yatsushiro Natl Coll Technol, Dept Mech & Elec Eng, Yatsushiro 8668501, Japan
[3] JEOL Ltd, Akishima, Tokyo 1968558, Japan
[4] Asahi Chem Ind Co Ltd, Tokyo, Japan
来源
关键词
bonded dissimilar plate; crack-tip stress field; fracture mechanics; infrared thermography;
D O I
10.4028/www.scientific.net/KEM.177-180.87
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Tensile tests are carried out using rectangular plate specimens extracted from the explosion clad plate. An artificial through-the-thickness edge crack or parallel cracks are made in each specimen. The cracks are close and perpendicular to the explosive interface. Stress field near cracks, stress intensity factor and crack opening displacement are examined by experiment as well as elasto-plastic finite element analysis. The stress field and stress intensity factor are evaluated by an infrared stress imaging system. The effects of the material inhomogeneity, residual stress, the change of material characteristics and the interaction of parallel cracks on the stress field, the stress intensity factor and the deformation behavior are revealed. The lower strength material ahead of the bonded interface increases the stress intensity factor and the crack opening displacement. The higher strength material ahead of the bonded interface decreases the stress intensity factor and the crack opening displacement.
引用
收藏
页码:87 / 92
页数:6
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