A REVIEW OF COMPUTER SIMULATIONS IN POWDER INJECTION MOLDING

被引:0
|
作者
Park, Seong Jin [1 ]
Ahn, Seokyoung [2 ]
Kang, Tae Gon [3 ]
Chung, Seong-Taek [4 ]
Kwon, Young-Sam [4 ]
Chung, Suk Hwan [5 ]
Kim, Seong-Gon [6 ]
Kim, Seongjai [7 ]
Atre, Sundar V. [8 ]
Lee, Shiwoo [8 ]
German, Randall M. [9 ]
机构
[1] POSTECH, Pohang 790784, Kyongbuk, South Korea
[2] Univ Texas Pan Amer, Edinburg, TX 78539 USA
[3] Korea Aerosp Univ, Sch Aerosp & Mech Engn, Goyang City 412791, Gyeonggi Do, South Korea
[4] CetaTech Inc, TIC 296 3, Sacheon Si 664953, Kyongnam, South Korea
[5] Hyundai Steel Co, Dangjin Gun 343711, Chungnam, South Korea
[6] Mississippi State Univ, Dept Phys & Astron, Mississippi State, MS 39762 USA
[7] Mississippi State Univ, CAVS, Starkville, MS 39759 USA
[8] Oregon State Univ, ONAMI, Corvallis, OR 97330 USA
[9] San Diego State Univ, Coll Engn, San Diego, CA 92182 USA
来源
关键词
EMBEDDED-ATOM POTENTIALS; BINDER REMOVAL; NUMERICAL-SIMULATION; CONSTITUTIVE MODEL; MICRO COMPONENTS; COOLING SYSTEM; SLIP; DENSIFICATION; TRANSPORT; BURNOUT;
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
The powder injection molding (PIM) process is complicated since it is a hybrid technology embracing plastic injection molding, powder metallurgy (PM), and ceramic processing. In developing this technology, engineers have relied heavily on trial-and-error experiments. As a fundamental understanding of the inherent physical phenomena emerges, process modeling has progressed by utilizing new and customized simulation tools. These computational tools allow for parallel design of the component and process via analysis, prediction, and optimization modules. This contribution reviews computer simulation efforts and the future of this methodology.
引用
收藏
页码:37 / 46
页数:10
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