Acoustic emission signals during thermal processing of gypsum-bonded-investment.

被引：0
|
作者：
Kim, KH
Esaki, K
Yoshida, K
Asaoka, K
机构：
[1] KYUNG POOK NATL UNIV,TAEGU,SOUTH KOREA
[2] UNIV TOKUSHIMA,TOKUSHIMA,JAPAN
来源：
JOURNAL OF DENTAL RESEARCH | 1996年 / 75卷
关键词：
D O I：
暂无
中图分类号：
R78 [口腔科学];
学科分类号：
1003 ;
摘要：
引用
收藏
页码：365 / 365
页数：1
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