Coimplantation effects on the electrical properties of boron and aluminum acceptors in 4H-SiC

被引:28
|
作者
Itoh, H
Troffer, T
Pensl, G
机构
[1] Univ Erlangen Nurnberg, Inst Phys Appl, D-91058 Erlangen, Germany
[2] Japan Atom Energy Res Inst, Gunma 37012, Japan
关键词
ion implantation; C coimplantation; Si coimplantation electrical properties; boron acceptor; aluminum acceptor;
D O I
10.4028/www.scientific.net/MSF.264-268.685
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of coimplantation of carbon (C) and boron (B)/aluminum (Al) or silicon (Si) and B/Al on the electrical activation of B/Al accepters in 4H-SiC was studied by Hall effect investigations. The free hole concentration is found to increase due to coimplantation of C/B or C/AI. Compared to it, coimplantation of Si/B or Si/Al reduces the free hole concentration. For room temperature-implantation, the optimum concentration of coimplanted C atoms is found to be [C]approximate to=1x10(18)/cm(3) for an implanted acceptor concentration of [B]=[Al]=5x10(18)/cm(3) A further increase of the free hole concentration is found by employing hot-implantation of C at 800 degrees C. The mechanisms, which alter the electrical properties of B/Al accepters due to C- or Si-coimplantation, are discussed.
引用
收藏
页码:685 / 688
页数:4
相关论文
共 50 条
  • [1] Aluminum acceptors in inequivalent sites in 4H-SiC
    Smith, SR
    Evwaraye, AO
    Mitchel, WC
    DEFECT AND IMPURITY ENGINEERED SEMICONDUCTORS II, 1998, 510 : 193 - 198
  • [2] Aluminum and boron diffusion in 4H-SiC
    Linnarsson, MK
    Janson, MS
    Schöner, A
    Svensson, BG
    SILICON CARBIDE 2002-MATERIALS, PROCESSING AND DEVICES, 2003, 742 : 291 - 301
  • [3] Aluminum implantation in 4H-SiC: physical and electrical properties
    Michaud, J. F.
    Song, X.
    Biscarrat, J.
    Cayrel, F.
    Collard, E.
    Alquier, D.
    SILICON CARBIDE AND RELATED MATERIALS 2012, 2013, 740-742 : 581 - +
  • [4] Boron and aluminum diffusion into 4H-SiC substrates
    Kubiak, Andrzej
    Rogowski, Jacek
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2011, 176 (04): : 297 - 300
  • [5] Electrical transport properties of aluminum-implanted 4H-SiC
    Pernot, J
    Contreras, S
    Camassel, J
    JOURNAL OF APPLIED PHYSICS, 2005, 98 (02)
  • [6] Selective doping of 4H-SiC by codiffusion of aluminum and boron
    Gao, Y
    Soloviev, SI
    Sudarshan, TS
    Tin, CC
    JOURNAL OF APPLIED PHYSICS, 2001, 90 (11) : 5647 - 5651
  • [7] Boron centers in 4H-SiC
    Aradi, B
    Gali, A
    Deák, P
    Rauls, E
    Frauenheim, T
    Son, NT
    SILICON CARBIDE AND RELATED MATERIALS, ECSCRM2000, 2001, 353-356 : 455 - 458
  • [9] Complete surface exfoliation of 4H-SiC by H+- and Si+-coimplantation
    Bennett, JA
    Holland, OW
    Budde, M
    Thomas, DK
    Feldman, LC
    APPLIED PHYSICS LETTERS, 2000, 76 (22) : 3265 - 3267
  • [10] Electron paramagnetic resonance of deep boron acceptors in 4H-SiC and 3C-SiC crystals
    P. G. Baranov
    I. V. Il’in
    E. N. Mokhov
    Physics of the Solid State, 1998, 40 : 31 - 34