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ZrO2 insulator modified by a thin Al2O3 film to enhance the performance of InGaZnO thin-film transistor
被引:14
|作者:
Ding, Xingwei
[1
]
Zhang, Jianhua
[2
]
Zhang, Hao
[2
]
Ding, He
[1
]
Huang, Chuanxin
[1
]
Li, Jun
[1
]
Shi, Weimin
[1
]
Jiang, Xueyin
[1
]
Zhang, Zhilin
[1
,2
]
机构:
[1] Shanghai Univ, Dept Mat Sci, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China
基金:
中国国家自然科学基金;
关键词:
IGZO thin-film transistor;
ZrO2-Al2O3 bilayer gate insulator;
ALD;
Bias stability;
SEMICONDUCTOR;
THICKNESS;
OXIDE;
D O I:
10.1016/j.microrel.2014.06.011
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
A high-performance InGaZnO (IGZO) thin-film transistor (TFT) with ZrO2-Al2O3 bilayer gate insulator is fabricated. Compared to IGZO-TFT with ZrO2 single gate insulator, its electrical characteristics are significantly improved, specifically, enhancement of I-on/I-off ratios by one order of magnitude, increase of the field-effect mobility (from 9.8 to 14 cm(2)/Vs), reduction of the subthreshold swing from 0.46 to 0.33 V/dec, the maximum density of surface states at the channel-insulator interface decreased from 4.3 x 10(12) to 2.5 x 10(12) cm(-2). The performance enhancements are attributed to the suppression of leakage current, smoother surface morphology, and suppression of charge trapping by using Al2O3 films to modify the high-k ZrO2 dielectric. (C) 2014 Elsevier Ltd. All rights reserved.
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页码:2401 / 2405
页数:5
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