ZrO2 insulator modified by a thin Al2O3 film to enhance the performance of InGaZnO thin-film transistor

被引:14
|
作者
Ding, Xingwei [1 ]
Zhang, Jianhua [2 ]
Zhang, Hao [2 ]
Ding, He [1 ]
Huang, Chuanxin [1 ]
Li, Jun [1 ]
Shi, Weimin [1 ]
Jiang, Xueyin [1 ]
Zhang, Zhilin [1 ,2 ]
机构
[1] Shanghai Univ, Dept Mat Sci, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China
基金
中国国家自然科学基金;
关键词
IGZO thin-film transistor; ZrO2-Al2O3 bilayer gate insulator; ALD; Bias stability; SEMICONDUCTOR; THICKNESS; OXIDE;
D O I
10.1016/j.microrel.2014.06.011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high-performance InGaZnO (IGZO) thin-film transistor (TFT) with ZrO2-Al2O3 bilayer gate insulator is fabricated. Compared to IGZO-TFT with ZrO2 single gate insulator, its electrical characteristics are significantly improved, specifically, enhancement of I-on/I-off ratios by one order of magnitude, increase of the field-effect mobility (from 9.8 to 14 cm(2)/Vs), reduction of the subthreshold swing from 0.46 to 0.33 V/dec, the maximum density of surface states at the channel-insulator interface decreased from 4.3 x 10(12) to 2.5 x 10(12) cm(-2). The performance enhancements are attributed to the suppression of leakage current, smoother surface morphology, and suppression of charge trapping by using Al2O3 films to modify the high-k ZrO2 dielectric. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2401 / 2405
页数:5
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