In Situ endpoint detection by acoustic emissions in chemical -: Mechanical polishing of metal overlay

被引：12
|
作者：
Hocheng, Hong [1 ]
Huang, Yun-Liang [1 ]
机构：
[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu, Taiwan
来源：
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 2007年 / 20卷 / 03期
关键词：
acoustic emission; chemical-mechanical polishing (CMP); copper overlay; endpoint detection; pad; thermal; monitoring;
D O I：
10.1109/TSM.2007.901406
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：306 / 312
页数：7
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