Application of thin films prepared by impulse magnetron sputtering for shielding of electromagnetic fields.

被引：0
|
作者：
Ziaja, Jan [1 ]
Ozimek, Mariusz [1 ]
Janukiewicz, Jaroslaw [2 ]
机构：
[1] Wroclaw Univ Technol, Inst Podstaw Elektrotech & Elektrotechnol, PL-50370 Wroclaw, Poland
[2] Wroclaw Univ Technol, Inst Telekomunikacji Teleinformat & Akust, PL-50370 Wroclaw, Poland
来源：
PRZEGLAD ELEKTROTECHNICZNY | 2010年 / 86卷 / 05期
关键词：
electromagnetic field; shielding effectiveness; magnetron sputtering; thin films;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Electromagnetic thin shields were prepared by deposition of metallic Ni-Fe and Al targets via impulse magnetron sputtering. Thin films sputtered onto cable papers in argon atmosphere. Metallization was carried out, at different sputtering times. The influence of layer's thicknesses and their sequence on surface resistivity and shielding effectiveness was observed. The highest value of attenuation received 25 dB (Application of thin films prepared by impulse magnetron sputtering for shielding of electromagnetic fields).
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页码：222 / 224
页数：3
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