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- [4] Reliability of a dual-curable adhesive bond [J]. 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2016,
- [10] Hydrogen bond networks: Structure and evolution after hydrogen bond breaking [J]. JOURNAL OF PHYSICAL CHEMISTRY B, 2004, 108 (21): : 6544 - 6554