Tin Whisker mitigation methodologies

被引:1
|
作者
Starkey, Pete
机构
来源
关键词
D O I
10.1080/00202967.2017.1283896
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:180 / 182
页数:3
相关论文
共 50 条
  • [1] Detection of tin pilating and tin whisker mitigation
    Bjorndahl, WD
    Singleton, L
    Griese, R
    Chong, F
    2004 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS, 2004, : 563 - 564
  • [2] Ni Barrier for Tin Whisker Mitigation
    Liu, Ting
    Ding, Dongyan
    Wang, Yiqing
    Hu, Yu
    Gong, Yihua
    Galuschki, Klaus-Peter
    2012 2ND IEEE CPMT SYMPOSIUM JAPAN, 2012,
  • [3] Platelet Composite Coatings for Tin Whisker Mitigation
    Rohwer, Lauren E. S.
    Martin, James E.
    JOURNAL OF ELECTRONIC MATERIALS, 2015, 44 (11) : 4424 - 4433
  • [4] Platelet Composite Coatings for Tin Whisker Mitigation
    Lauren E. S. Rohwer
    James E. Martin
    Journal of Electronic Materials, 2015, 44 : 4424 - 4433
  • [5] Mitigation of Tin Whisker Growth by Dopant Addition
    Meinshausen, Lutz
    Banerjee, Soumik
    Dutta, Indranath
    Majumdar, Bhaskar
    INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, 2015,
  • [6] Tin whisker mitigation study on alloy 42 pure tin plating
    Sriyarunya, Anocha
    Tondtan, Jiraporn
    EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 726 - 732
  • [7] Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation
    Sungwon Han
    Michael Osterman
    Stephan Meschter
    Michael Pecht
    Journal of Electronic Materials, 2012, 41 : 2508 - 2518
  • [8] Mitigation of tin whisker growth by inserting Ni nanocones
    Sun, Menglong
    Long, Xiaoping
    Dong, Mengya
    Xia, Yuanyuan
    Hu, Fengtian
    Hu, An-Min
    Li, Ming
    MATERIALS CHARACTERIZATION, 2017, 134 : 354 - 361
  • [9] Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation
    Han, Sungwon
    Osterman, Michael
    Meschter, Stephan
    Pecht, Michael
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (09) : 2508 - 2518
  • [10] Assessment of Solder-Dipping as a Tin Whisker Mitigation Strategy
    Mathew, Sony
    Wang, Weiqiang
    Osterman, Michael
    Pecht, Michael
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (06): : 957 - 963