Stress-induced martensite in NiTi corrugated films

被引：0
|
作者：
Wuttig, M [1 ]
Slutsker, JS [1 ]
Mori, K [1 ]
Li, J [1 ]
机构：
[1] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA
来源：
MATERIALS OF SMART SYSTEMS III | 2000年 / 604卷
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Films deposited on corrugated surfaces develop non-uniform stresses when cooled from the deposition temperature. A disclination model shows that the stresses have rhombohedral and tetragonal components which can preferentially stress induce the martensite variants. The deflection of NiTi/Si bimorphs caused by the formation of martensite should thus be different if the NiTi/Si interface is corrugated or not. Experimental results confirm this expectation.
引用
收藏
页码：105 / 108
页数：4
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