A Novel Vertical Solder Pump Structure for Through-Wafer Interconnects

被引：0
|
作者：
Gu, Jiebin [1 ]
Pike, W. T. [1 ]
Karl, W. J. [1 ]
机构：
[1] Univ London Imperial Coll Sci Technol & Med, Dept EEE, London SW7 2AZ, England
来源：
MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Through wafer interconnection is a critical technology for advanced packaging. Previously, we have proposed a solder pump technology which could complete the via filling through solder reflow. Here, an improved vertical solder-pump structure is presented and successfully demonstrated. This technology allows producing an arbitrary array of highly conductive vias in seconds.
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收藏
页码：500 / 503
页数：4
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