A new concept® for making fine line substrate for active component in polymer

Miniaturization in electronics means finer lines and smaller vias in substrate technology. Very fine lines on the substrate are difficult to produce by conventional PWB manufacturing means. Thick copper layers are difficult to etch and the accuracy of conventional dry film photoresist is not necessarily sufficient. On the other hand, the environmental issues force us to reduce pollution. In this paper a new concept (FSBQ) for making thin, buried active component in polymer, non-reinforced PWB, using electroformatting, dry process (sputtering), electrical lithography and growing processes, via holes and build-up method, is described. To find reliability, tests of peel strength, roughness and some pre-treatments, which act on the adhesion of metal to the dielectric layer between circuits, have been made. Similarly in the tests, the capability of the electrodeposited photosensitive lithography has been compared with the results of the dry and the spin coated liquid films. (C) 2002 Elsevier Science Ltd. All rights reserved.