On the degradation of the solder joints of underfilled flip chip packages: a case study

被引:0
|
作者
Zhang, Q [1 ]
Xie, XM
Chen, L
Wang, GZ
Cheng, ZN
Kempe, W
机构
[1] DaimlerChrysler SIM Technol Co Ltd, Shanghai, Peoples R China
[2] DaimlerChrysler AG, Res Inst, Frankfurt, Germany
关键词
solder joints; reliability; flip chip on board; underfill; delamination; crack propagation;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The lifetime of flip chip solder joints can be greatly increased by applying underfill encapsulation. This paper presents a case study where the thermal cycle lifetime was increased by more than 20 times, that is from similar to 100 cycles to more than 2,000 cycles for a chip size of 5.6mm x 6.3mm. By combining electrical, acoustic and metallographic investigation, the degradation of the solder joints was monitored, some important factors relevant to solder joint reliability were analysed and discussed. Delamination was found not to he the dominant failure mode.
引用
收藏
页码:24 / 28
页数:5
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