On the degradation of the solder joints of underfilled flip chip packages: a case study

被引：0
|
作者：
Zhang, Q [1 ]
Xie, XM
Chen, L
Wang, GZ
Cheng, ZN
Kempe, W
机构：
[1] DaimlerChrysler SIM Technol Co Ltd, Shanghai, Peoples R China
[2] DaimlerChrysler AG, Res Inst, Frankfurt, Germany
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2000年 / 12卷 / 03期
关键词：
solder joints; reliability; flip chip on board; underfill; delamination; crack propagation;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The lifetime of flip chip solder joints can be greatly increased by applying underfill encapsulation. This paper presents a case study where the thermal cycle lifetime was increased by more than 20 times, that is from similar to 100 cycles to more than 2,000 cycles for a chip size of 5.6mm x 6.3mm. By combining electrical, acoustic and metallographic investigation, the degradation of the solder joints was monitored, some important factors relevant to solder joint reliability were analysed and discussed. Delamination was found not to he the dominant failure mode.
引用
收藏
页码：24 / 28
页数：5
相关论文
共 50 条
  • [1] Estimation of thermal fatigue life of solder joints in flip chip packages
    Tsukamoto, K
    Hori, E
    [J]. NEC RESEARCH & DEVELOPMENT, 2000, 41 (04): : 383 - 387
  • [2] Electromigration study in flip chip solder joints
    Nah, Jae-Woong
    Chen, Kai
    Suh, J. O.
    Tu, K. N.
    [J]. 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1450 - +
  • [3] Failure mechanism of lead-free solder joints in flip chip packages
    Zhang, F
    Li, M
    Balakrisnan, B
    Chen, WT
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) : 1256 - 1263
  • [4] Failure mechanism of lead-free solder joints in flip chip packages
    Fan Zhang
    Ming Li
    Bavani Balakrisnan
    William T. Chen
    [J]. Journal of Electronic Materials, 2002, 31 : 1256 - 1263
  • [5] A Systematic Exploration of the Failure Mechanisms in Underfilled Flip-Chip Packages
    Sinha, Tuhin
    Davis, Taryn J.
    Lombardi, Thomas E.
    Coffin, Jeffery T.
    [J]. 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1509 - 1517
  • [6] Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
    Yang, D.
    Chan, Y. C.
    Wu, B. Y.
    Pecht, M.
    [J]. JOURNAL OF MATERIALS RESEARCH, 2008, 23 (09) : 2333 - 2339
  • [7] Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
    Yang D.
    Chan Y.C.
    Wu B.Y.
    Pecht M.
    [J]. Journal of Materials Research, 2008, 23 (9) : 2333 - 2339
  • [8] TIM degradation in flip chip packages
    Islam, Nokibul
    Lee, SeoWon
    Jimarez, Miguel
    Lee, JoonYeob
    Galloway, Jesse
    [J]. 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 259 - +
  • [9] Fracture behaviour of flip chip solder joints
    Wiese, S
    Jakschik, S
    Feustel, F
    Meusel, E
    [J]. 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1299 - 1306
  • [10] Crack propagation in flip chip solder joints
    Wiese, S
    Jakschik, S
    Feustel, F
    Heeg, J
    Meusel, E
    [J]. MICRO MATERIALS, PROCEEDINGS, 2000, : 1273 - 1275
12345