Crystallographic failure analysis of film near cooling hole under temperature gradient of nickel-based single crystal superalloys

In this paper, a unit cell model with a film cooling hole has been set up to analyze the crystallographic stress characterization and failure behavior under temperature gradient of nickel-base single crystallographic superalloys (SC). The aim of this work is to study the failure behavior of SC blades with film cooling. The distribution of cooling air pressure on the hole side surface and the distribution of the temperature around the hole are obtained from the fluid analysis. The result of the temperature distribution is then transferred tothe finite element model (cell model) by the interpolation method. The cell model is analyzed by the crystallographic rate dependent finite element method (FEM). Special attention is put on the influence of temperature gradient. The influence of the loading boundaries, i.e. displacement loading and stress loading, on the stress characterization around hole is also taken into consideration. The results show that temperature gradient hole has much influence on the stress characterization. Different types of loading boundaries result in different types of stress and strain distributions. There is clear stress concentration near the hole under displacement loading, while there is clear strain concentration under stress loading. The failure characterization has been studied by the strain energy density criterion. It is shown that the temperature gradient has influence on the failure behavior. (c) 2006 Elsevier Ltd. All rights reserved.