Optimization of PBGA Encapsulation Considering Fluid/Structure Interaction Using Response Surface Methodology

This paper presents the optimization of the Plastic Ball Grid Array (PBGA) package during the encapsulation process. Optimized design of the PBGA package enhances the encapsulation process and minimizes the stress and deformation on the wires. The physical and process parameters (i.e., pressure inlet, diameter of wire, vent height, and mould filled time) were optimized via response surface methodology using central composite design (CCD) to minimize the stress of wire, wire sweep, filling time and void in package during the encapsulation process. The optimization of the PBGA encapsulation was carried out by considering the fluid/structure interaction (FSI) aspects. The optimum empirical models were examined and well confirmed with the simulation results. The optimum design of the PBGA package (30 mm x 30 mm) for both physical and process parameters was characterized by 8 wire bonds, 0.25 mm of vent thickness, 4.46 s of filling time and 2.52 % of void at the inlet condition of 10 MPa.