Camera on a chip

被引：18

|

作者：

Ackland, B ^{[1
]}

Dickinson, A ^{[1
]}

机构：

[1] AT&T BELL LABS,HOLMDEL,NJ 07733

来源：

1996 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS | 1996年 / 39卷

关键词：

D O I：

10.1109/ISSCC.1996.488499

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：22 / 25

页数：4

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