Schottky Barrier Catalysis Mechanism in Metal-Assisted Chemical Etching of Silicon

被引:95
|
作者
Lai, Ruby A. [1 ]
Hymel, Thomas M. [1 ,2 ]
Narasimhan, Vijay K. [2 ,4 ]
Cui, Yi [3 ]
机构
[1] Stanford Univ, Dept Phys, 382 Via Pueblo, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Mat Sci & Engn, 476 Lomita Mall, Stanford, CA 94305 USA
[3] SLAC Natl Accelerator Lab, Stanford Inst Mat & Energy Sci, 2575 Sand Hill Rd, Menlo Pk, CA 94025 USA
[4] Intermolecular, 3011 North First St, San Jose, CA 95134 USA
关键词
metal-assisted chemical etching; nanoporous catalyst; reaction mechanism; anisotropic etching; kinetic rate exponents; dopant etch stop; HIGH-ASPECT-RATIO; POROUS SILICON; NANOFABRICATION; NANOPARTICLES; NANOWIRES; TRANSPORT; ARRAYS;
D O I
10.1021/acsami.6b01020
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Metal-assisted chemical etching (MACE) is a versatile anisotropic etch for silicon although its mechanism is not well understood. Here we propose that the Schottky junction formed between metal and silicon plays an essential role on the distribution of holes in silicon injected from hydrogen peroxide. The proposed mechanism can be used to explain the dependence of the etching kinetics on the doping level, doping type, crystallographic surface direction, and etchant solution composition. We used the doping dependence of the reaction to fabricate a novel etch stop for the reaction.
引用
收藏
页码:8875 / 8879
页数:5
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