Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link

被引:2
|
作者
Yuan, Yuxiang [1 ]
Yoshida, Yoichi [1 ]
Kuroda, Tadahiro [1 ]
机构
[1] Keio Univ, Yokohama, Kanagawa 2238522, Japan
来源
IEICE TRANSACTIONS ON ELECTRONICS | 2010年 / E93C卷 / 02期
关键词
wireless power link; wireless power delivery; inductive-coupling; inductor; rectifier; SiP; SIP;
D O I
10.1587/transele.E93.C.164
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A wireless power link utilizing inductive coupling is developed between stacked chips. In this paper, we discuss inductor layout optimization and rectifier circuit design. The inductive-coupling power link is analyzed using simple equivalent circuit models. On the basis of the analytic models, the inductor size is minimized for the given required power on the receiver chip. Two kinds of full-wave rectifiers are discussed and compared. Various low-power circuit design techniques for rectifiers are employed to decrease the substrate leakage current, reduce the possibility of latch-up, and improve the power transmission efficiency and the high-frequency performance of the rectifier block. Test chips are fabricated in a 0.18 mu m CMOS process. With a pair of 700 x 700 mu m(2) on-chip inductors, the test chips achieve 10% peak efficiency and 36 mW power transmission. Compared with the previous work the received power is 13 times larger for the same inductor size [7].
引用
收藏
页码:164 / 171
页数:8
相关论文
共 50 条
  • [1] Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect
    Miura, N
    Mizoguchi, D
    Sakurai, T
    Kuroda, T
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2005, 40 (04) : 829 - 837
  • [2] Analysis and design of transceiver circuit and inductor layout for inductive inter-chip wireless superconnect
    Miura, N
    Mizoguchi, D
    Yusof, YB
    Sakurai, T
    Kuroda, T
    [J]. 2004 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2004, : 246 - 249
  • [3] Analysis and measurement of misalignment effect in inductive-coupling wireless inter-chip connection
    Zhang, Li
    Xu, Xiaowei
    Li, Dawei
    Zou, Jun
    Zou, Xuecheng
    [J]. IEICE ELECTRONICS EXPRESS, 2017, 14 (12):
  • [4] 60% Power reduction in inductive-coupling inter-chip link by current-sensing technique
    Niitsu, Kiichi
    Miura, Noriyuki
    Inoue, Mari
    Nakagawa, Yoshihiro
    Tago, Masamoto
    Mizuno, Masayuki
    Ishikuro, Hiroki
    Kuroda, Tadahiro
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (4B): : 2215 - 2219
  • [5] Inductive Coupling Transceivers for Inter-chip Data Communication
    Kuroda, Tadahiro
    [J]. 2009 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY: SYNERGY OF RF AND IC TECHNOLOGIES, PROCEEDINGS, 2009, : 13 - 15
  • [6] Inductive Coupling Transceivers for Inter-chip Data Communication
    Kuroda, Tadahiro
    [J]. 2009 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT 2009), 2009, : 372 - 374
  • [7] Design of transceiver circuits for NRZ signaling in inductive inter-chip wireless superconnect
    Mizoguchi, D
    Miura, N
    Inoue, M
    Kuroda, T
    [J]. 2005 INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, 2005, : 59 - 62
  • [8] Cross talk countermeasures in inductive inter-chip wireless superconnect
    Miura, N
    Mizoguchi, D
    Sakurai, T
    Kuroda, T
    [J]. PROCEEDINGS OF THE IEEE 2004 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2004, : 99 - 102
  • [9] A 50% power reduction in inductive-coupling transceiver for 3D-stacked inter-chip data link
    Zhang, Li
    Li, Tie
    Wang, Baocun
    Zou, Xuecheng
    [J]. 7TH IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE (INEC) 2016, 2016,
  • [10] Wireless inter-chip interconnects
    Kikkawa, Takamaro
    [J]. MICROELECTRONIC ENGINEERING, 2011, 88 (05) : 767 - 774