A model of Cu-CMP

被引：0
|
作者：
Paul, E [1 ]
Brusic, V [1 ]
Sun, F [1 ]
Zhang, J [1 ]
Vacassy, R [1 ]
Kaufman, F [1 ]
机构：
[1] Stockton State Coll, Pomona, NJ 08240 USA
来源：
ADVANCES IN CHEMICAL-MECHANICAL POLISHING | 2004年 / 816卷
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D O I：
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中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
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页码：55 / 61
页数：7
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