Experimental analysis and finite element modelling of nano-scratch test applied on 40-120 nm SiCN thin films deposited on Cu/Si substrate

被引：25
|
作者：
Roy, S. [1 ,2 ]
Darque-Ceretti, E. [1 ]
Felder, E. [1 ]
Raynal, F. [2 ]
Bispo, I. [2 ]
机构：
[1] CNRS, MINES ParisTech, CEMEF Ctr Mise Forme Mat, UMR, F-06904 Sophia Antipolis, France
[2] Alchimer SA, ZI Bonde, F-91300 Massy, France
来源：
THIN SOLID FILMS | 2010年 / 518卷 / 14期
关键词：
Nano-scratch; Thin films; SiCN; Copper; Finite element modelling; Adhesion; INDENTATION EXPERIMENTS; COPPER INTERCONNECTS; PLASTIC INDENTATION; MECHANICAL ANALYSIS; ALLOY SUBSTRATE; CRITICAL LOAD; CARBON-FILMS; ADHESION; QUANTIFICATION; DEFORMATION;
D O I：
10.1016/j.tsf.2010.02.004
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this work, the nano-scratch test is used to characterize the interfacial adhesion of amorphous SiCN thin films deposited by plasma enhanced chemical vapour deposition on Cu/Si substrates. The experimental results show that the critical load F(c) is directly related to the rupture of the SiCN/Cu interface. A strong linear dependence of F(c) to the SiCN thickness independently to the adhesion is also put in evidence. A three-dimensional finite element model of the test is then built. The results show a clear relation between the stresses into the coating and the cracking and buckling of the film observed experimentally. We then discuss how the interfacial tensile stresses can explain the increase of F(c) with the film thickness. (C) 2010 Elsevier B.V. All rights reserved.
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页码：3859 / 3865
页数：7
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