An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu7In3

被引:11
|
作者
Yu, Ching-Feng [1 ]
Cheng, Hsien-Chie [2 ]
Chen, Wen-Hwa [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 30013, Taiwan
[2] Feng Chia Univ, Dept Aerosp & Syst Engn, Taichung 40724, Taiwan
关键词
Ab initio calculations; Intermetallic compounds; Elastic properties; Thermodynamic properties; CU-IN FILMS; HEAT-CAPACITY; SOLDER; RELIABILITY; COPPER; PRECURSORS; SOLIDS; PHASES; GROWTH; UBM;
D O I
10.1016/j.matchemphys.2016.02.053
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
First principles density functional theory calculations within the generalized gradient approximation are performed to comprehensively study the structural, elastic, electronic and thermodynamic properties of triclinic single and polycrystalline Cu7In3. The polycrystalline elastic properties are predicted using the Voigt-Reuss-Hill approximation and the thermodynamic properties are evaluated based on the quasi harmonic Debye model. Their temperature, hydrostatic pressure or crystal orientation dependences are also addressed, and the predicted physical properties are compared with the literature experimental and theoretical data and also with those of three other Cu-In compounds, i.e., CuIn, Cu2In and Cu11In9. The present calculations show that in addition to being a much better conductor compared to Cu2In and Cu11In9, Cu7In3 crystal reveals weak elastic anisotropy, high ductility and low stiffness, and tends to become more elastically isotropic at very high hydrostatic pressure. Moreover, the Cu7In3 holds the largest high-temperature heat capacity among the four Cu-In compounds. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:70 / 80
页数:11
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