Application of the Moire interferometry to thermal strain analysis for electronics packaging

被引：0

作者：

Zhong, ZW ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

来源：

APPLICATIONS OF PHOTONIC TECHNOLOGY 5: CLOSING THE GAP BETWEEN THEORY, DEVELOPMENT, AND APPLICATION | 2002年 / 4833卷

关键词：

micro moire; thermal strain; electronics packaging; scanning moire;

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

The moire interferometry has been used to investigate the strains induced by thermal loading in various electronics packages. The AFM scanning moire technique has also been utilized to measure the strains of electronics packages with an even better resolution. The advantages and disadvantages of the full field moire, the micro moire, and the AFM scanning moire techniques are compared.

引用

页码：242 / 248

页数：7

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