Modulated-temperature thermomechanical analysis

被引:25
|
作者
Price, DM [1 ]
机构
[1] Loughborough Univ Technol, IPTME, Loughborough LE11 3TU, Leics, England
关键词
modulated-temperature TMA; orientation; creep;
D O I
10.1016/S0040-6031(00)00360-9
中图分类号
O414.1 [热力学];
学科分类号
摘要
The application of modulated-temperature programming to thermomechanical analysis affords a method for separating the reversible nature of thermal expansion from irreversible deformation arising from creep under the applied load or changes in dimensions due to relaxation of orientation. Measurements may be made under tension (for thin films and fibres) or compression (for self-supporting specimens). The treatment of data is similar to that employed in modulated-temperature DSC (MTDSC). The superposition of a dynamic load in addition to a modulated-temperature program leads to modulated-temperature dynamic mechanical analysis. (C) 2000 Elsevier Science B.V. All rights reserved.
引用
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页码:23 / 29
页数:7
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