Heat transfer analysis of infrared nondestructive testing

被引：0

作者：

Chen, J ^{[1
]}

机构：

[1] Southeast Univ, Dept Elect Engn, Nanjing 210096, Jiangsu, Peoples R China

来源：

JOURNAL OF INFRARED AND MILLIMETER WAVES | 2000年 / 19卷 / 04期

关键词：

infrared nondestructive testing; delamination; surface temperature difference;

D O I：

暂无

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

One-dimensional equation of heat conduction, its initial conditions and boundary conditions were described. The surface temperature difference between the flawed and the unflawed regions was given. The surface temperature difference versus heating time, delamination thickness in bonding silicon wafers containing delamination was calculated. The experiment was carried out by using an infrared thermal imager.

引用

页码：285 / 288

页数：4