3D Stacked Microprocessor: Are We There Yet?

被引：21
|
作者：
Loh, Gabriel H. [1 ]
Xie, Yuan [2 ]
机构：
[1] Georgia Inst Technol, Coll Comp, Atlanta, GA 30332 USA
[2] Penn State Univ, Dept Comp Sci & Engn, University Pk, PA 16802 USA
来源：
IEEE MICRO | 2010年 / 30卷 / 03期
关键词：
D O I：
10.1109/MM.2010.45
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：60 / 63
页数：4
相关论文
共 50 条
  • [1] 3D Imaging of TCFA: Are We There Yet?
    Cilingiroglu, Mehmet
    Hakeem, Abdul
    [J]. CATHETERIZATION AND CARDIOVASCULAR INTERVENTIONS, 2013, 81 (03) : 550 - 550
  • [2] 3D Integration Technology for 3D Stacked Retinal Chip
    Kaiho, Y.
    Ohara, Y.
    Takeshita, H.
    Kiyoyama, K.
    Lee, K-W
    Tanaka, T.
    Koyanagi, M.
    [J]. 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 211 - +
  • [3] Design for 3D Stacked Circuits
    Franzon, P.
    Davis, W.
    Rotenberg, E.
    Stevens, J.
    Lipa, S.
    Nigussie, T.
    Pan, H.
    Baker, L.
    Schabel, J.
    Dey, S.
    Li, W.
    [J]. 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
  • [4] Thermal for 3D stacked modules✩
    Chen, Yanning
    Zhao, Dongyan
    Liu, Fang
    Gao, Jie
    Zhu, Hui
    [J]. MICROELECTRONICS JOURNAL, 2023, 139
  • [5] 3D transistor is fastest yet
    不详
    [J]. ELECTRONICS WORLD, 2003, 109 (1809): : 5 - 5
  • [6] CT scanning and data post-processing with 3D and 4D reconstruction: Are we there yet?
    Fishman, E. K.
    [J]. DIAGNOSTIC AND INTERVENTIONAL IMAGING, 2020, 101 (11) : 691 - 692
  • [7] Packaging for 3D Optoelectronic stacked processors
    Marchand, PJ
    Zheng, XZ
    Huang, DW
    Ozguz, V
    Esener, S
    [J]. OPTOELETRONIC INTEGRATED CIRCUITS AND PACKAGING III, 1999, 3631 : 142 - 147
  • [8] 3D printed stacked diffractive microlenses
    Thiele, Simon
    Pruss, Christof
    Herkommer, Alois M.
    Giessen, Harald
    [J]. OPTICS EXPRESS, 2019, 27 (24) : 35621 - 35630
  • [9] Electrical Modeling of 3D Stacked TSV
    Zhang, Zhi-Min
    Lin, Shin-Chun
    Pan, Chung-Long
    Huang, Yu-Jung
    [J]. 2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2017, : 254 - 257
  • [10] 3D stacked NAND flash memories
    Micheloni, Rino
    Crippa, Luca
    [J]. 3D Flash Memories, 2016, : 63 - 83
12345