Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

被引:79
|
作者
Yoo, Myong Jae [1 ,2 ]
Kim, Sang Hyun [2 ]
Park, Seong Dae [2 ]
Lee, Woo Sung [2 ]
Sun, Jong-Woo [1 ]
Choi, Jae-Hong [1 ]
Nahm, Sahn [1 ]
机构
[1] Korea Univ, Dept Mat Sci & Engn, Seoul 136701, South Korea
[2] Korea Elect Technol Inst, Elect Mat & Device Res Ctr, Songnam 463816, South Korea
关键词
Cure kinetics; Cycloaliphatic epoxy resin; Differential scanning calorimetry; Activation energy; DIFFERENTIAL SCANNING CALORIMETRY; ANHYDRIDE SYSTEM; CURE KINETICS; CROSS-LINKING;
D O I
10.1016/j.eurpolymj.2010.02.001
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1158 / 1162
页数:5
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