Thermal challenges in next generation electronic systems - Summary of panel presentations and discussions

被引：65

作者：

Garimella, SV ^{[1
]}

Joshi, YK

Bar-Cohen, A

Mahajan, R

Toh, KC

Carey, VP

Baelmans, M

Lohan, J

Sammakia, B

Andros, F

机构：

[1] Purdue Univ, W Lafayette, IN 47907 USA

[2] Georgia Inst Technol, Atlanta, GA 30332 USA

[3] Univ Maryland, College Pk, MD 20742 USA

[4] Intel Corp, Chandler, AZ 85226 USA

[5] Intel Corp, Chandler, AZ 85226 USA

[6] Nanyang Technol Univ, Singapore 2263, Singapore

[7] Univ Calif Berkeley, Berkeley, CA 94720 USA

[8] Katholieke Univ Leuven, Louvain, Belgium

[9] Galway Mayo Inst Technol, Galway, Ireland

[10] SUNY Binghamton, Binghamton, NY 13901 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2002年 / 25卷 / 04期

关键词：

D O I：

10.1109/TCAPT.2003.809113

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.

引用

页码：569 / 575

页数：7

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