EDA tools for high-performance MCM

High density interconnect and MCM designs involve variety of diverse technologies, including ceramics, laminates and deposited thin films as well as combinations of technologies such as hybrid MCM-D/L. Chips may be attached in CSP (Chip Scale Packages) or via flip chip or bonded techniques. A design tool suite that encompasses all these substrate technologies, packages, chip packages and attaches requires a flexible design methodology. In this paper we discuss a high density interconnect design methodology and describe the Tanner MCM Pro integrated MCM and IC design environment which combines strong features of both IC and PCB approaches to EDA and addresses shortcomings of existing tools and design flows.