Pattern Transfer of Sub-10 nm Features via Tin-Containing Block Copolymers

被引:22
|
作者
Maher, Michael J. [1 ]
Mori, Kazunori [2 ]
Sirard, Stephen M. [3 ]
Dinhobl, Andrew M. [2 ]
Bates, Christopher M. [4 ]
Gurer, Emir [5 ]
Blachut, Greory [2 ]
Lane, Austin P. [2 ]
Durand, William J. [2 ]
Carlson, Matthew C. [2 ]
Strahan, Jeffrey R. [1 ]
Ellison, Christopher J. [2 ]
Willson, C. Grant [1 ,2 ]
机构
[1] Univ Texas Austin, Dept Chem, Austin, TX 78712 USA
[2] Univ Texas Austin, McKetta Dept Chem Engn, Austin, TX 78712 USA
[3] Lam Res Corp, 12345 North Lamar 150, Austin, TX 78753 USA
[4] CALTECH, Arnold & Mabel Beckman Labs Chem Synth, Pasadena, CA 91125 USA
[5] Lam Res Corp, 4400 Cushing Pkwy, Fremont, CA 94538 USA
基金
美国国家科学基金会;
关键词
SURFACE NEUTRALIZATION; POLYMERIZATION; DESIGN; POLYDIMETHYLSILOXANE; NANOLITHOGRAPHY; LITHOGRAPHY; ORIENTATION; DERIVATIVES; FABRICATION; DEVICE;
D O I
10.1021/acsmacrolett.6b00005
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Tin-containing block copolymers were investigated as materials for nanolithographic applications. Poly(4-trimethylstannylstyrene-block-styrene) (PSnS-PS) and poly(4-trimethylstannylstyrene-Hock-4-methoxystyrene) (PSnSPMOST) synthesized by reversible addition fragmentation chain transfer polymerization form lamellar domains with periodicities ranging from 18 to 34 nm. Thin film orientation control was achieved by thermal annealing between a neutral surface treatment and a top coat. Incorporation of tin into one block facilitates pattern transfer into SiO2 via a two-step etch process utilizing oxidative and fluorine-based etch chemistries.
引用
收藏
页码:391 / 395
页数:5
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